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High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage

High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage

ब्रांड नाम: Hiner-pack
मॉडल संख्या: एचएन24164
एमओक्यू: 500 पीसीएस
कीमत: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
भुगतान की शर्तें: टी/टी
आपूर्ति करने की क्षमता: 2000 पीसी/दिन
विस्तृत जानकारी
उत्पत्ति के प्लेस:
चीन
प्रमाणन:
ROHS, ISO
रंग:
आमतौर पर काला
गुणवत्ता आश्वासन:
डिलीवरी की गारंटी, विश्वसनीय गुणवत्ता
इन्कोटर्म्स:
EXW, FOB, CIF, DDU, DDP
मोल्ड प्रकार:
इंजेक्शन
पुन: प्रयोज्य:
हाँ
ट्रे का आकार:
आयताकार
स्वच्छ वर्ग:
सामान्य और अल्ट्रासोनिक सफाई
आईसी प्रकार:
बीजीए, क्यूएफपी, क्यूएफएन, एलजीए, पीजीए
पैकिंग स्तर:
परिवहन पैकेज
वारपेज:
वॉरपेज मैक्स 0.24 मिमी
क्षमता:
10x20=200 पीसीएस
पैकेजिंग विवरण:
गत्ते का डिब्बा, फूस
आपूर्ति की क्षमता:
2000 पीसी/दिन
उत्पाद का वर्णन
Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

High precision cleanroom waffle pack trays fit strict semiconductor cleanroom production standards. Delivers powerful particulate contamination isolation performance for ultra-fine pitch fragile IC components. Do you need professional precision holders to guard valuable chips from pollution damage during manufacturing?


Features standardized JEDEC elongated grid cavity structure. Resists scratches, static interference and dust invasion effectively. Maintains stable clean performance across chip handling, transfer and daily storage procedures.


Owns durable stackable precision loading design. Fully adapts semiconductor packaging, testing, logistics transportation and inventory demands. Preserves complete clean intact status of high-value sensitive IC chips in whole industrial chains.

Key Features/ Benefits 
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Adopts high-precision elongated JEDEC grid structure
  • Protects ultra-delicate fine pitch ESD-sensitive IC chips
Specifications
Brand Hiner-pack
Model HN24164
Color Usually black 
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Matrix QTY 10x20=200 PCS
Cavity Size  3.00X0.7X0.22
Warpage MAX 0.24mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.


With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.

Customized Services
Waffle pack IC trays support fully customized cavity grid layouts and slot sizes. Custom designs match diverse fine pitch IC chip specifications. Customized dimension, material and JEDEC standard structures meet exclusive cleanroom production and handling demands for different semiconductor application scenarios.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers