JEDEC TRAY के लिए कारखाने उपकरण विवरण दिखाएँ

कार्यशाला प्रदर्शन
October 07, 2023
Brief: Discover the Tiny Modules 4 Inch Waffle Pack Chip Trays, designed for ESD stability and anti-static protection. Perfect for transporting and handling bare dies, these trays are customizable, high-temperature resistant, and compliant with international environmental standards. Ideal for wafer dies, PCBA modules, and electronic component packaging.
Related Product Features:
  • Customized high-temperature resistant Waffle Pack for carrying tiny modules.
  • ESD stable and anti-static performance to protect chips from damage.
  • Lightweight and small size, reducing transportation costs.
  • Each tray accommodates a large number of chips for efficient testing and transfer.
  • Excellent flatness for easy operation on automatic equipment.
  • Compatible with covers and clips for versatile shipping methods.
  • Recyclable and biodegradable plastic material, environmentally friendly.
  • Stackable design maximizes tray matrix utilization.
अक्सर पूछे जाने वाले प्रश्न:
  • Can you do OEM and customized design IC trays?
    Yes, we have strong mold manufacturing and product design capabilities, with extensive experience in producing various IC trays.
  • How long is your delivery time?
    Delivery typically takes 5-8 working days, depending on the order quantity.
  • Do you provide samples? Is it free or extra?
    Yes, we offer samples. They may be free or charged based on product value, with shipping costs typically collected or as agreed.
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कार्यशाला प्रदर्शन
October 07, 2023